Inventor
VAN SOESTBERGEN MICHIEL
NL3 patents
Patents
3 patentsUS10825789B1Nov 3, 2020
Underbump metallization dimension variation with improved reliability
NXP BV2 citations67
US12061228B2Aug 13, 2024
Degradation monitor for bond wire to bond pad interfaces
NXP BV0 citations55
US11508669B2Nov 22, 2022
Method and apparatus for improved circuit structure thermal reliability on printed circuit board materials
NXP BV0 citations53