Inventor
YANG BO-JIUN
TW5 patents
Patents
5 patentsUS11640930B2May 2, 2023
Semiconductor package having liquid-cooling lid
MEDIATEK INC2 citations71
US12300573B2May 13, 2025
Semiconductor device and manufacturing method thereof
MEDIATEK INC0 citations61
US12087664B2Sep 10, 2024
Semiconductor package having liquid-cooling lid
MEDIATEK INC1 citations60
US12021068B2Jun 25, 2024
Semiconductor device with dummy thermal features on interposer
MEDIATEK INC0 citations59
US12411474B2Sep 9, 2025
Integrated circuit configurable to perform adaptive thermal ceiling control in per-functional-block manner, associated main circuit, associated electronic device and associated thermal control method
MEDIATEK INC0 citations44