Inventor
YOO BONG-YOUNG
KR6 patents
⚠️ This page may combine multiple inventors who share the name “YOO BONG-YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
5 patentsUS5863835AJan 26, 1999
Methods of forming electrical interconnects on semiconductor substrates
SAMSUNG ELECTRONICS CO LTD33 citations91
US6693032B2Feb 17, 2004
Method of forming a contact structure having an anchoring portion
SAMSUNG ELECTRONICS CO LTD5 citations73
US6476489B1Nov 5, 2002
Apparatus and manufacturing method for semiconductor device adopting NA interlayer contact structure
SAMSUNG ELECTRONICS CO LTD11 citations73
US6211082B1Apr 3, 2001
Chemical vapor deposition of tungsten using nitrogen-containing gas
SAMSUNG ELECTRONICS CO LTD7 citations73
US6372616B1Apr 16, 2002
Method of manufacturing an electrical interconnection of a semiconductor device using an erosion protecting plug in a contact hole of interlayer dielectric layer
SAMSUNG ELECTRONICS CO LTD13 citations68