Inventor
LEI RYAN
US5 patents
Patents
5 patentsUS6908027B2Jun 21, 2005
Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process
INTEL CORP224 citations97
US6833195B1Dec 21, 2004
Low temperature germanium transfer
INTEL CORP30 citations91
US7279369B2Oct 9, 2007
Germanium on insulator fabrication via epitaxial germanium bonding
INTEL CORP10 citations82
US7161224B2Jan 9, 2007
Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process
INTEL CORP12 citations82
US7211890B2May 1, 2007
Integrating thermoelectric elements into wafer for heat extraction
INTEL CORP4 citations61