P

Inventor

OH HUENG JAE

KR8 patents
⚠️ This page may combine multiple inventors who share the name “OH HUENG JAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

4 patents
US7893355B2Feb 22, 2011

Lead pin for package boards

SAMSUNG ELECTRO MECH10 citations82
US8651356B2Feb 18, 2014

Solder bump forming apparatus and soldering facility including the same

SAMSUNG ELECTRO MECH0 citations51
US9142499B2Sep 22, 2015

Lead pin for package substrate

SAMSUNG ELECTRO MECH0 citations49
US8708215B2Apr 29, 2014

Solder ball supplying apparatus

SAMSUNG ELECTRO MECH1 citations48

OH HUENG JAE

2 patents
US8671564B2Mar 18, 2014

Substrate for flip chip bonding and method of fabricating the same

OH HUENG JAE3 citations56
US8785789B2Jul 22, 2014

Printed circuit board and method for manufacturing the same

OH HUENG JAE0 citations36

CHUNG TAE JOON

1 patent
US8486760B2Jul 16, 2013

Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same

CHUNG TAE JOON2 citations56

LEE KI TAEK

1 patent
US8766450B2Jul 1, 2014

Lead pin for package substrate

LEE KI TAEK0 citations43