Inventor
HUR YOUNG SIK
KR59 patents
⚠️ This page may combine multiple inventors who share the name “HUR YOUNG SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
29 patentsUS10347598B2Jul 9, 2019
Composite antenna substrate and semiconductor package module
SAMSUNG ELECTRO MECH22 citations94
US10511080B2Dec 17, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH14 citations86
US11031675B2Jun 8, 2021
Antenna module
SAMSUNG ELECTRO MECH7 citations84
US11488906B2Nov 1, 2022
Bridge embedded interposer, and package substrate and semiconductor package comprising the same
SAMSUNG ELECTRO MECH6 citations74
US11503713B2Nov 15, 2022
Antenna substrate and antenna module including the same
SAMSUNG ELECTRO MECH2 citations73
US11096269B2Aug 17, 2021
Printed circuit board assembly
SAMSUNG ELECTRO MECH4 citations73
US11095037B2Aug 17, 2021
Antenna module
SAMSUNG ELECTRO MECH2 citations73
US10887994B2Jan 5, 2021
Antenna substrate and antenna module including the same
SAMSUNG ELECTRO MECH4 citations73
US10700024B2Jun 30, 2020
Fan-out semiconductor package
SAMSUNG ELECTRO MECH2 citations73
US10608319B2Mar 31, 2020
Antenna module
SAMSUNG ELECTRO MECH5 citations73
US10242973B2Mar 26, 2019
Fan-out-semiconductor package module
SAMSUNG ELECTRO MECH4 citations73
US11335991B2May 17, 2022
Electronic device with radio-frequency module
SAMSUNG ELECTRO MECH2 citations70
US11228337B2Jan 18, 2022
Apparatus with transmission route switching of radio frequency signals and radio frequency module
SAMSUNG ELECTRO MECH2 citations70
US11985757B2May 14, 2024
Printed circuit board assembly
SAMSUNG ELECTRO MECH0 citations62
US11646504B2May 9, 2023
Chip antenna module array
SAMSUNG ELECTRO MECH0 citations62
US11581275B2Feb 14, 2023
Antenna module
SAMSUNG ELECTRO MECH0 citations62
US11539138B2Dec 27, 2022
Chip radio frequency package and radio frequency module
SAMSUNG ELECTRO MECH1 citations62
US11322857B2May 3, 2022
Chip antenna module array
SAMSUNG ELECTRO MECH0 citations62
US11245192B2Feb 8, 2022
Chip antenna
SAMSUNG ELECTRO MECH1 citations62
US11183765B2Nov 23, 2021
Chip radio frequency package and radio frequency module
SAMSUNG ELECTRO MECH0 citations62
US11158928B2Oct 26, 2021
Chip antenna module
SAMSUNG ELECTRO MECH1 citations62
US11133592B2Sep 28, 2021
Chip radio frequency package and radio frequency module
SAMSUNG ELECTRO MECH1 citations62
US10886242B2Jan 5, 2021
Antenna module
SAMSUNG ELECTRO MECH1 citations62
US10347613B1Jul 9, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH1 citations62
US11658393B2May 23, 2023
Electronic device with radio-frequency module
SAMSUNG ELECTRO MECH0 citations60
US11264719B2Mar 1, 2022
Radio frequency module
SAMSUNG ELECTRO MECH0 citations60
US11394103B2Jul 19, 2022
Antenna module and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations52
US10971454B2Apr 6, 2021
Semiconductor package
SAMSUNG ELECTRO MECH0 citations52
US10840225B1Nov 17, 2020
Package-on-package and package connection system comprising the same
SAMSUNG ELECTRO MECH0 citations52
SAMSUNG ELECTRONICS CO LTD
20 patentsUS10547119B2Jan 28, 2020
Antenna Module
SAMSUNG ELECTRONICS CO LTD12 citations86
US10763225B2Sep 1, 2020
Antenna module
SAMSUNG ELECTRONICS CO LTD6 citations84
US10985451B2Apr 20, 2021
Antenna module
SAMSUNG ELECTRONICS CO LTD7 citations82
US11217543B2Jan 4, 2022
Antenna module
SAMSUNG ELECTRONICS CO LTD2 citations73
US10832986B2Nov 10, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations73
US10741509B2Aug 11, 2020
Antenna module
SAMSUNG ELECTRONICS CO LTD3 citations72
US11909099B2Feb 20, 2024
Antenna module
SAMSUNG ELECTRONICS CO LTD0 citations62
US11469193B2Oct 11, 2022
Antenna module
SAMSUNG ELECTRONICS CO LTD0 citations62
US11177551B2Nov 16, 2021
Antenna module
SAMSUNG ELECTRONICS CO LTD0 citations62
US11038279B2Jun 15, 2021
Antenna module
SAMSUNG ELECTRONICS CO LTD1 citations62
US10998247B2May 4, 2021
Board with embedded passive component
SAMSUNG ELECTRONICS CO LTD1 citations62
US10930593B2Feb 23, 2021
Package on package and package connection system comprising the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US10833040B2Nov 10, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US10811379B2Oct 20, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US10790595B2Sep 29, 2020
Antenna module and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD1 citations62
US11777200B2Oct 3, 2023
Antenna module
SAMSUNG ELECTRONICS CO LTD0 citations61
US11532572B2Dec 20, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11075175B2Jul 27, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations61
US10403562B2Sep 3, 2019
Fan-out semiconductor package module
SAMSUNG ELECTRONICS CO LTD1 citations61
US11037971B2Jun 15, 2021
Fan-out sensor package and optical fingerprint sensor module including the same
SAMSUNG ELECTRONICS CO LTD0 citations60
SAMSUNG ELECTRO & MDASH MECHANICS COMPANY LTD
1 patentShowing the top 50 of 59 patents by PatentIndex Score.