Inventor

HSU TAI-TSUNG

TW2 patents

Patents

2 patents

US9887102B2Feb 6, 2018

Method for manufacturing multi-chip package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations44

US9305885B2Apr 5, 2016

Multi-chip package and method for manufacturing the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations44