Inventor

ANDREWS PETER S

US48 patents

⚠️ This page may combine multiple inventors who share the name “ANDREWS PETER S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ANDREWS PETER S

CREE INC

Power surface mount light emitting die package

Light emitting diodes including barrier layers/sublayers

Light emitting diodes including modifications for submount bonding

Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same

Cluster packaging of light emitting diodes

Collets for bonding of light emitting diodes having shaped substrates

High voltage array light emitting diode (LED) devices and fixtures

Methods of manufacturing light emitting diodes including barrier layers/sublayers

Methods of fabricating light emitting devices using mesa regions and passivation layers

Methods for combining light emitting devices in a package and packages including combined light emitting devices

Wire bonded light emitting diode (LED) components including reflective layer

Multi-chip light emitter packages and related methods

Semiconductor light emitting devices with applied wavelength conversion materials

Submount-free light emitting diode (LED) components and methods of fabricating same

Systems for assembling components on submounts and methods therefor

Multi-lens LED-array optic system

Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface

Systems for assembling components on submounts and methods therefor

Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same

Light emitting diode (LED) components including contact expansion frame

Light emitting diodes including current spreading layer and barrier sublayers

Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface

Light emitting devices suitable for flip-chip bonding

Bonding of light emitting diodes having shaped substrates

ANDREWS PETER S

Multiple configuration light emitting device package

Solid state light emitting apparatus with thermal management structures and methods of manufacturing

Electronic device submounts with thermally conductive vias and light emitting devices including the same

Semiconductor light emitting devices with optical coatings and methods of making same

Multiple configuration light emitting devices and methods

Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants

Structures and substrates for mounting optical elements and methods and devices for providing the same background

Solid state light emitting diode packages with leadframes and ceramic material

Light emitting devices for light conversion and semiconductor chips for fabricating the same

LED chip design for white conversion

Semiconductor light emitting devices with applied wavelength conversion materials and methods for forming the same

DONOFRIO MATTHEW

Lamp packages

Conformally coated light emitting devices and methods for providing the same

Light emitting diode (LED) arrays including direct die attach and related assemblies

Lamp packages

Methods of forming optical conversion material caps

WILCOX KURT S

Multi-lens LED-array optic system

LED-array light source with aspect ratio greater than 1

SLATER JR DAVID B

Light emitting diodes including barrier layers/sublayers and manufacturing methods therefor

Light emitting diodes including barrier sublayers

IBBETSON JAMES

Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface

CREE MICROWAVE INC

Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding

CREE MICROWAVE LLC

Flip-chip bonding of light emitting devices

EMERSON DAVID TODD

Methods for combining light emitting devices in a package and packages including combined light emitting devices