Inventor
ISHIZAKA YASUSHI
JP8 patents
Patents
8 patentsUS10988646B2Apr 27, 2021
Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the same
FURUKAWA ELECTRIC CO LTD0 citations59
US10196547B2Feb 5, 2019
Resin composition for sealing electronic device, and electronic device
FURUKAWA ELECTRIC CO LTD1 citations59
US10079360B2Sep 18, 2018
Resin composition for sealing electronic devices, and electronic device
FURUKAWA ELECTRIC CO LTD0 citations50
US10556974B2Feb 11, 2020
Curable and hygroscopic resin composition for sealing electronic devices, sealing resin, and electronic device
FURUKAWA ELECTRIC CO LTD0 citations49
US10084153B2Sep 25, 2018
Filler material for organic electroluminescent element and method of sealing organic electroluminiscent element
FURUKAWA ELECTRIC CO LTD1 citations49
US9793511B2Oct 17, 2017
Filler material for organic electroluminescent element and method of sealing organic electroluminescent element
FURUKAWA ELECTRIC CO LTD0 citations48
US10829669B2Nov 10, 2020
Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device
FURUKAWA ELECTRIC CO LTD0 citations39
US10196534B2Feb 5, 2019
Resin composition for sealing electronic device, and electronic device
FURUKAWA ELECTRIC CO LTD0 citations38