Inventor
HUANG CHENG-LING
TW7 patents
Patents
7 patentsUS10812017B1Oct 20, 2020
Semiconductor package structure
ADVANCED SEMICONDUCTOR ENG12 citations83
US10910507B2Feb 2, 2021
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations71
US11682684B2Jun 20, 2023
Optical package structure
ADVANCED SEMICONDUCTOR ENG0 citations61
US12392966B2Aug 19, 2025
Optical module
ADVANCED SEMICONDUCTOR ENG0 citations60
US11296651B2Apr 5, 2022
Semiconductor package structure
ADVANCED SEMICONDUCTOR ENG0 citations60
US11551963B2Jan 10, 2023
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations56
US10446454B2Oct 15, 2019
Semiconductor device package structure
ADVANCED SEMICONDUCTOR ENG0 citations46