Inventor
BAE SUNGHAWN
KR6 patents
Patents
6 patentsUS12243791B2Mar 4, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11881472B2Jan 23, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11393795B2Jul 19, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations59
US11342239B2May 24, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11393767B2Jul 19, 2022
Semiconductor package and package-on-package devices including same
SAMSUNG ELECTRONICS CO LTD1 citations54
US11152292B2Oct 19, 2021
Fan-out semiconductor package having metal pattern layer electrically connected embedded semiconductor chip and redistribution layer
SAMSUNG ELECTRONICS CO LTD0 citations46