Inventor
KIM SUNGHOAN
KR2 patents
Patents
2 patentsUS11264339B2Mar 1, 2022
Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations55
US11393767B2Jul 19, 2022
Semiconductor package and package-on-package devices including same
SAMSUNG ELECTRONICS CO LTD1 citations54