Inventor

SUN XIAOXUAN

US3 patents

Patents

3 patents

US12412868B2Sep 9, 2025

Microelectronic assemblies including interconnects with different solder materials

INTEL CORP0 citations60

US12581988B2Mar 17, 2026

Microelectronic assemblies with through die attach film connections

INTEL CORP0 citations59

US12243792B2Mar 4, 2025

Microelectronic structures including bridges

INTEL CORP0 citations49