Inventor
DIVAKARUNI RENUKA S
US9 patents
Patents
9 patentsUS4885038ADec 5, 1989
Method of making multilayered ceramic structures having an internal distribution of copper-based conductors
IBM72 citations95
US4772346ASep 20, 1988
Method of bonding inorganic particulate material
IBM65 citations94
US5468445ANov 21, 1995
Ceramic via composition, multilayer ceramic circuit containing same, and process for using same
IBM20 citations92
US5139851AAug 18, 1992
Low dielectric composite substrate
IBM22 citations92
US5135595AAug 4, 1992
Process for fabricating a low dielectric composite substrate
IBM24 citations91
US5277725AJan 11, 1994
Process for fabricating a low dielectric composite substrate
IBM17 citations81
US5336444AAug 9, 1994
Ceramic via composition, multilayer ceramic circuit containing same, and process for using same
IBM14 citations73
US5147741ASep 15, 1992
Phenyl-endcapped depolymerizable polymer
IBM12 citations72
US4987211AJan 22, 1991
Phenyl-endcapped depolymerizable polymer
IBM7 citations70