Inventor
GONYA STEPHEN G
US10 patents
⚠️ This page may combine multiple inventors who share the name “GONYA STEPHEN G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
6 patentsUS5393489AFeb 28, 1995
High temperature, lead-free, tin based solder composition
IBM56 citations94
US5368814ANov 29, 1994
Lead free, tin-bismuth solder alloys
IBM69 citations94
US5328660AJul 12, 1994
Lead-free, high temperature, tin based multi-component solder
IBM56 citations94
US5411703AMay 2, 1995
Lead-free, tin, antimony, bismtuh, copper solder alloy
IBM41 citations91
US5344607ASep 6, 1994
Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
IBM25 citations91
US5414303AMay 9, 1995
Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
IBM19 citations81
LOCKHEED CORP
4 patentsUS6410857B1Jun 25, 2002
Signal cross-over interconnect for a double-sided circuit card assembly
LOCKHEED CORP129 citations97
US7242365B1Jul 10, 2007
Seam arrangement for a radome
LOCKHEED CORP22 citations89
US7151504B1Dec 19, 2006
Multi-layer radome
LOCKHEED CORP36 citations89
US7804179B2Sep 28, 2010
Plastic ball grid array ruggedization
LOCKHEED CORP0 citations47