Inventor
FURUSAWA TAKESHI
JP43 patents
⚠️ This page may combine multiple inventors who share the name “FURUSAWA TAKESHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SKYWORKS SOLUTIONS INC
10 patentsUS11811385B2Nov 7, 2023
Bulk acoustic wave component with conductor extending laterally from via
SKYWORKS SOLUTIONS INC4 citations86
US11588465B2Feb 21, 2023
Stacked temperature compensated acoustic wave device with high thermal conductivity
SKYWORKS SOLUTIONS INC8 citations86
US11581870B2Feb 14, 2023
Stacked acoustic wave resonator package with laser-drilled VIAS
SKYWORKS SOLUTIONS INC8 citations86
US11496111B2Nov 8, 2022
Methods of plasma dicing bulk acoustic wave components
SKYWORKS SOLUTIONS INC6 citations86
US11251769B2Feb 15, 2022
Bulk acoustic wave components
SKYWORKS SOLUTIONS INC6 citations86
US12407315B2Sep 2, 2025
Stacked filter package having multiple types of acoustic wave devices
SKYWORKS SOLUTIONS INC0 citations62
US12375057B2Jul 29, 2025
Method of manufacturing a self-shielded acoustic wave device package
SKYWORKS SOLUTIONS INC0 citations62
US12301210B2May 13, 2025
Method of making stacked acoustic wave resonator package with laser-drilled vias
SKYWORKS SOLUTIONS INC0 citations62
US12143091B2Nov 12, 2024
Methods of plasma dicing bulk acoustic wave components
SKYWORKS SOLUTIONS INC0 citations62
US11765814B2Sep 19, 2023
Devices and methods related to nested filters
SKYWORKS SOLUTIONS INC1 citations62
IBIDEN CO LTD
10 patentsUS9723729B2Aug 1, 2017
Printed wiring board
IBIDEN CO LTD15 citations83
US8347493B2Jan 8, 2013
Wiring board with built-in electronic component and method of manufacturing same
IBIDEN CO LTD8 citations83
US9497849B2Nov 15, 2016
Printed wiring board
IBIDEN CO LTD4 citations73
US9713267B2Jul 18, 2017
Method for manufacturing printed wiring board with conductive post and printed wiring board with conductive post
IBIDEN CO LTD4 citations68
US9474158B2Oct 18, 2016
Printed wiring board
IBIDEN CO LTD2 citations63
US8365402B2Feb 5, 2013
Method for manufacturing printed wiring board
IBIDEN CO LTD0 citations52
US9917025B2Mar 13, 2018
Printed wiring board and method for manufacturing printed wiring board
IBIDEN CO LTD1 citations51
US9793200B2Oct 17, 2017
Printed wiring board
IBIDEN CO LTD0 citations41
US9401320B2Jul 26, 2016
Combined substrate
IBIDEN CO LTD0 citations39
US9980371B2May 22, 2018
Printed wiring board
IBIDEN CO LTD0 citations38
HITACHI LTD
7 patentsUS5609511AMar 11, 1997
Polishing method
HITACHI LTD413 citations99
US6777325B2Aug 17, 2004
Semiconductor manufacturing method for low-k insulating film
HITACHI LTD20 citations92
US6479380B2Nov 12, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD36 citations92
US6680541B2Jan 20, 2004
Semiconductor device and process for producing the same
HITACHI LTD15 citations91
US6358838B2Mar 19, 2002
Semiconductor device and process for producing the same
HITACHI LTD27 citations91
US6599830B2Jul 29, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD10 citations74
US7379456B2May 27, 2008
Network routing apparatus
HITACHI LTD4 citations62
RENESAS TECH CORP
4 patentsUS7605448B2Oct 20, 2009
Semiconductor device with seal ring
RENESAS TECH CORP22 citations92
US7700487B2Apr 20, 2010
Semiconductor device and manufacturing method of semiconductor device
RENESAS TECH CORP7 citations74
US6903445B2Jun 7, 2005
Semiconductor device having low-K insulating film
RENESAS TECH CORP4 citations63
US7602063B2Oct 13, 2009
Semiconductor device and manufacturing method therefor
RENESAS TECH CORP2 citations62
RENESAS ELECTRONICS CORP
3 patentsUS8018030B2Sep 13, 2011
Semiconductor chip with seal ring and sacrificial corner pattern
RENESAS ELECTRONICS CORP7 citations84
US9368459B2Jun 14, 2016
Semiconductor chip with seal ring and sacrificial corner pattern
RENESAS ELECTRONICS CORP1 citations62
US7960279B2Jun 14, 2011
Semiconductor device and manufacturing method therefor
RENESAS ELECTRONICS CORP0 citations52
FURUSAWA TAKESHI
3 patentsUS8963291B2Feb 24, 2015
Semiconductor chip with seal ring and sacrificial corner pattern
FURUSAWA TAKESHI3 citations60
US8203210B2Jun 19, 2012
Semiconductor device having metal contacts formed in an interlayer dielectric film comprising four silicon-containing layers
FURUSAWA TAKESHI4 citations59
US8097948B2Jan 17, 2012
Semiconductor device and manufacturing method of semiconductor device
FURUSAWA TAKESHI0 citations51