Inventor

CHUANG CHITA

TW50 patents

⚠️ This page may combine multiple inventors who share the name “CHUANG CHITA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUANG CHITA

TAIWAN SEMICONDUCTOR MFG CO LTD

Elongated bump structures in package structure

Dummy flip chip bumps for reducing stress

Metal routing architecture for integrated circuits

Scheme for connector site spacing and resulting structures

Semiconductor package structure and manufacturing method thereof

Bonded structures for package and substrate

Stress reduction apparatus and method

Bump on pad (BOP) bonding structure in semiconductor packaged device

Bonded structures for package and substrate

Substrate pad structure

Dummy flip chip bumps for reducing stress

Interconnection structure

Bonded structures for package and substrate

Connector structure and method of forming same

Bump interconnection techniques

Method for manufacturing semiconductor package structure

Semiconductor device and package assembly including the same

Connector structure and method of forming same

Wireless charging devices having wireless charging coils and methods of manufacture thereof

Stress reduction apparatus and method

Stress reduction apparatus and method

Substrate pad structure

Connector structure and method of forming same

Substrate pad structure

Dummy flip chip bumps for reducing stress

Wireless charging devices having wireless charging coils and methods of manufacture thereof

Connector structure and method of forming same

Bump on pad (BOP) bonding structure in semiconductor packaged device

Elongated bump structures in package structure

Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device

Packaging assembly and method of making the same

TAIWAN SEMICONDUCTOR MFG

Metal routing architecture for integrated circuits

Substrate pad structure

Bonded structures for package and substrate

Dummy flip chip bumps for reducing stress

Bonded structures for package and substrate

Bump on pad (BOP) bonding structure

Elongated bump structures in package structure

Methods and apparatus for flip chip substrate with guard rings outside of a die attach region

Bonded structures for package and substrate

Packaging and function tests for package-on-package and system-in-package structures

CHUANG YAO-CHUN

Stress reduction apparatus

Metal pad structures in dies

LIU HAO-JUIN

Semiconductor device package and method

Packaging and function tests for package-on-package and system-in-package structures

CHUANG CHITA

Bump structures in semiconductor device and packaging assembly

Reflow system and method for conductive connections

WU SHENG-YU

Dummy flip chip bumps for reducing stress

KUO CHEN-CHENG

Elongated bump structure in semiconductor device

KUO TIN-HAO

Elongated bump structure for semiconductor devices