Inventor

BAILEY III ANDREW D

US129 patents

⚠️ This page may combine multiple inventors who share the name “BAILEY III ANDREW D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BAILEY III ANDREW D

LAM RES CORP

Bevel etcher with gap control

Minimizing arcing in a plasma processing chamber

Apparatus and methods for minimizing arcing in a plasma processing chamber

Method and apparatus for producing uniform process rates

Plasma-enhanced etching in an augmented plasma processing system

Apparatus and methods for improving the stability of RF power delivery to a plasma load

Plasma processing systems

Method and apparatus for controlling the volume of a plasma

Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework

Method and apparatus for plasma forming inner magnetic bucket to control a volume of a plasma

Apparatus and methods for improving the stability of RF power delivery to a plasma load

Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization

Configurable bevel etcher

Apparatus for the removal of an edge polymer from a substrate and methods therefor

User interface for quantifying wafer non-uniformities and graphically explore significance

System and method for stress free conductor removal

Antenna for producing uniform process rates

Temperature control system for plasma processing apparatus

Offset correction methods and arrangement for positioning and inspecting substrates

Offset correction techniques for positioning substrates

Etch metric sensitivity for endpoint detection

Layout pattern proximity correction through edge placement error prediction

Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework

Methods and apparatuses for etch profile matching by surface kinetic model optimization

Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization

Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization

Bevel etcher with vacuum chuck

Apparatus and methods to remove films on bevel edge and backside of wafer

Apparatus for the removal of a metal oxide from a substrate and methods therefor

Method for adjusting voltage on a powered Faraday shield

Methods and apparatus for measuring morphology of a conductive film on a substrate

Stress free etch processing in combination with a dynamic liquid meniscus

Plasma in-situ treatment of chemically amplified resist

Method and apparatus for producing uniform process rates

Method of etch model calibration using optical scatterometry

Method of feature exaction from time-series of spectra to control endpoint of process

Edge electrodes with variable power

System, method and apparatus for improved global dual-damascene planarization

Methods of and apparatus for aligning electrodes in a process chamber to protect an exclusion area within an edge environ of a wafer

Method and apparatus for producing uniform processing rates

DHINDSA RAJINDER

Triode reactor design with multiple radiofrequency powers

Plasma processing chamber with dual axial gas injection and exhaust

Dual plasma volume processing apparatus for neutral/ion flux control

Local plasma confinement and pressure control arrangement and methods thereof

BAILEY III ANDREW D

Bevel etcher with vacuum chuck

Wafer bow metrology arrangements and methods thereof

Configurable bevel etcher

LAM CORP

Small volume process chamber with hot inner surfaces

YOON HYUNGSUK ALEXANDER

Methods for removing a metal oxide from a substrate

CHEN JACK

Offset correction techniques for positioning substrates within a processing chamber