Inventor
TSAI CHEN-HSUAN
TW14 patents
Patents
14 patentsUS10157888B1Dec 18, 2018
Integrated fan-out packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD24 citations93
US11355454B2Jun 7, 2022
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations85
US11990351B2May 21, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US10985140B2Apr 20, 2021
Structure and formation method of package structure with underfill
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11769739B2Sep 26, 2023
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12272568B2Apr 8, 2025
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12519087B2Jan 6, 2026
Package structure with underfill
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12412841B2Sep 9, 2025
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12142579B2Nov 12, 2024
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11854984B2Dec 26, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11817425B2Nov 14, 2023
Package structure with underfill
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12020952B2Jun 25, 2024
Method of fabricating semiconductor device having dummy micro bumps between stacking dies
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US11101145B2Aug 24, 2021
Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12599031B2Apr 7, 2026
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51