Inventor
IIZUKA KENTARO
JP20 patents
⚠️ This page may combine multiple inventors who share the name “IIZUKA KENTARO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
18 patentsUS7329564B2Feb 12, 2008
Wafer dividing method
DISCO CORP12 citations84
US7863160B2Jan 4, 2011
Wafer processing method including forming blocking and dividing grooves
DISCO CORP11 citations83
US7649157B2Jan 19, 2010
Chuck table for use in a laser beam processing machine
DISCO CORP8 citations83
US9381577B2Jul 5, 2016
Chuck table
DISCO CORP7 citations75
US9266315B2Feb 23, 2016
Separating apparatus
DISCO CORP4 citations72
US10916460B2Feb 9, 2021
Wafer producing apparatus
DISCO CORP2 citations71
US10840116B2Nov 17, 2020
Wafer producing apparatus
DISCO CORP4 citations69
US11328945B2May 10, 2022
Wafer forming apparatus
DISCO CORP0 citations62
US7772092B2Aug 10, 2010
Wafer processing method
DISCO CORP6 citations62
US7602071B2Oct 13, 2009
Apparatus for dividing an adhesive film mounted on a wafer
DISCO CORP3 citations62
US12479053B2Nov 25, 2025
Holding table assembly and processing method
DISCO CORP0 citations51
US11521877B2Dec 6, 2022
Carrier tray
DISCO CORP0 citations51
US11355359B2Jun 7, 2022
Workpiece processing method
DISCO CORP0 citations51
US10981250B2Apr 20, 2021
Wafer producing apparatus
DISCO CORP0 citations51
US10910241B2Feb 2, 2021
Wafer producing apparatus and carrying tray
DISCO CORP0 citations48
US12479048B2Nov 25, 2025
Wafer processing apparatus
DISCO CORP0 citations45
US10799987B2Oct 13, 2020
Laser processing apparatus
DISCO CORP0 citations39
US7799700B2Sep 21, 2010
Method for applying resin film to face of semiconductor wafer
DISCO CORP0 citations39