Inventor

YANG CHI-MING

TW150 patents

⚠️ This page may combine multiple inventors who share the name “YANG CHI-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YANG CHI-MING

TAIWAN SEMICONDUCTOR MFG CO LTD

3D IC bump height metrology APC

Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern

Multi-zone temperature control for semiconductor wafer

Chemical mechanical polishing (CMP) platform for local profile control

Method of manufacturing a semiconductor device and pattern formation method

Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern

Method of manufacturing a semiconductor device

Photoresist for semiconductor fabrication

Metrology method

Semiconductor lithography system and/or method

3D IC bump height metrology APC

Wafer processing system using multi-zone chuck

Reactive radical treatment for polymer removal and workpiece cleaning

Substrate rapid thermal heating system and methods

Apparatus and methods for chemical mechanical polishing

Solid precursor delivery method using liquid solvent for thin film deposition

System and method of cleaning FOUP

Semiconductor devices employing a barrier layer

High throughput CMP platform

ORACLE INT CORP

Flexible authentication framework

Flexible framework for secure search

Flexible authentication framework

Self-service sources for secure search

Flexible authentication framework

Index replication using crawl modification information

Flexible framework for secure search

TAIWAN SEMICONDUCTOR MFG

Germanium and arsenic double implanted pre-amorphization process for salicide technology

Finlike structures and methods of making same

Method of fabricating epitaxial structures

Amorphizing ion implant local oxidation of silicon (LOCOS) method for forming an isolation region

Method of fabricating high-k metal gate devices

Semiconductor devices and methods of manufacture thereof

YEH MING-HSI

Finlike structures and methods of making same

Method of fabricating an integrated circuit device

In-situ backside cleaning of semiconductor substrate

Cleaning process for semiconductor device fabrication

KU SHAO-YEN

Nitride film wet stripping

Integrated apparatus to assure wafer quality and manufacturability

CHANG CHUN-LIN

Multi-zone temperature control for semiconductor wafer

KRISHNAPRASAD MURALIDHAR

Flexible authentication framework

LIN SU-HORNG

Methods of fabricating metal hard masks

HUANG KUO BIN

High temperature anneal for aluminum surface protection

LIN SIMON SU-HORNG

Integration of bottom-up metal film deposition

CHEN YU-TING

Stand

VIEWMOVE TECHNOLOGIES INC

Measuring system and method for detecting object distance by transmitted media with different wave velocities

CHENG NAI-HAN

Wafer processing method and system using multi-zone chuck

LIEN CHANG ELECTRONIC ENTPR CO

High voltage transformer for controlling inductance leakage

CHIEN YING-HSUEH CHANG

Apparatus and methods for movable megasonic wafer probe

DELTA ELECTRONICS INC

Optical module

LEE BO I

Method and apparatus for performing a polishing process in semiconductor fabrication