Inventor

KIM YOON JOO

KR38 patents

⚠️ This page may combine multiple inventors who share the name “KIM YOON JOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM YOON JOO

AMKOR TECHNOLOGY INC

Wafer level stacked package

Electronic device package and fabricating method thereof

Package of finger print sensor and fabricating method thereof

Wafer level fan-out package with a fiducial die

Stacked semiconductor package and method of making same

Semiconductor package

Electronic device package and fabricating method thereof

Electronic device package and fabricating method thereof

Package of finger print sensor and fabricating method thereof

Semiconductor package with patterning layer and method of making same

Stacked semiconductor package and method of making same

Stack land grid array package and method for manufacturing the same

Electronic device package structure and method of fabricating the same

Semiconductor package and manufacturing method thereof

Semiconductor device

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

Semiconductor package and manufacturing method thereof

HYUNDAI MOTOR CO LTD

Negative pressure forming device for brake of vehicle

Supercharging system for engine

Control apparatus of engine having turbocharger and method thereof

Method of controlling electric continuous variable valve timing apparatus

Engine cooling system

Engine system

Brake negative pressure generating device for vehicle

Control method for turbocharger

Method for controlling exhaust gas recirculation system for engine

Control apparatus for engine having turbocharger and method thereof

Engine system

SAMSUNG ELECTRONICS CO LTD

Method for outputting image and electronic device supporting the same

Image processing apparatus and image processing method therefor

Method for processing omni-directional image using padding area and apparatus supporting the same

Electronic device for providing VR image based on polyhedron and image providing method thereof

AMKOR TECH SINGAPORE HOLDING PTE LTD

Electronic device package and fabricating method thereof

Electronic device package and fabricating method thereof

Electronic device package and fabricating method thereof

KOREA INST SCI & TECH

Wing-flapping flying apparatus and method of using the same

KIM YOUN SANG

Method of making semiconductor package with adhering portion

KIM DO HYEONG

Semiconductor package with patterning layer and method of making same