Inventor
CHA SE WOONG
KR25 patents
⚠️ This page may combine multiple inventors who share the name “CHA SE WOONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
16 patentsUS9831282B2Nov 28, 2017
Electronic device package and fabricating method thereof
AMKOR TECHNOLOGY INC9 citations92
US9129873B2Sep 8, 2015
Package of finger print sensor and fabricating method thereof
AMKOR TECHNOLOGY INC10 citations92
US8946883B2Feb 3, 2015
Wafer level fan-out package with a fiducial die
AMKOR TECHNOLOGY INC23 citations92
US10784178B2Sep 22, 2020
Wafer-level stack chip package and method of manufacturing the same
AMKOR TECHNOLOGY INC7 citations84
US10692918B2Jun 23, 2020
Electronic device package and fabricating method thereof
AMKOR TECHNOLOGY INC3 citations84
US10304890B2May 28, 2019
Electronic device package and fabricating method thereof
AMKOR TECHNOLOGY INC5 citations84
US9741701B2Aug 22, 2017
Method of manufacturing a package-on-package type semiconductor package
AMKOR TECHNOLOGY INC4 citations84
US9431447B2Aug 30, 2016
Package of finger print sensor and fabricating method thereof
AMKOR TECHNOLOGY INC8 citations84
US9818685B2Nov 14, 2017
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
AMKOR TECHNOLOGY INC4 citations83
US10290621B2May 14, 2019
Method of manufacturing a package-on-package type semiconductor package
AMKOR TECHNOLOGY INC2 citations73
US10199322B2Feb 5, 2019
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
AMKOR TECHNOLOGY INC1 citations72
US9406639B2Aug 2, 2016
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC2 citations63
US7982316B1Jul 19, 2011
Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereof
AMKOR TECHNOLOGY INC2 citations61
US10867984B2Dec 15, 2020
Method of manufacturing a package-on-package type semiconductor package
AMKOR TECHNOLOGY INC0 citations52
US10115705B2Oct 30, 2018
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations52
US10672699B2Jun 2, 2020
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
AMKOR TECHNOLOGY INC0 citations51
AMKOR TECH SINGAPORE HOLDING PTE LTD
7 patentsUS12033910B2Jul 9, 2024
Wafer-level stack chip package and method of manufacturing the same
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations73
US12255197B2Mar 18, 2025
Package-on-package type semiconductor package
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US12230661B2Feb 18, 2025
Electronic device package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11961867B2Apr 16, 2024
Electronic device package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11508712B2Nov 22, 2022
Method of manufacturing a package-on-package type semiconductor package
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11424180B2Aug 23, 2022
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11362128B2Jun 14, 2022
Electronic device package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62