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Inventor
YONEMOTO MICHIO
JP
3 patents
Patents
3 patents
US6547902B2
Apr 15, 2003
Die bonding method and apparatus
SHINKAWA KK
20 citations
90
US5208464A
May 4, 1993
Device for detecting errors in top/bottom/front/back orientation of a lead frame
SHINKAWA KK
9 citations
70
US6003655A
Dec 21, 1999
Lead frame separating and conveying apparatus
SHINKAWA KK
6 citations
55