Inventor
LAN JE-HSIUNG JEFFREY
US23 patents
⚠️ This page may combine multiple inventors who share the name “LAN JE-HSIUNG JEFFREY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
20 patentsUS9893048B2Feb 13, 2018
Passive-on-glass (POG) device and method
QUALCOMM INC7 citations84
US9721946B2Aug 1, 2017
Backside coupled symmetric varactor structure
QUALCOMM INC7 citations84
US9502586B1Nov 22, 2016
Backside coupled symmetric varactor structure
QUALCOMM INC13 citations84
US10290414B2May 14, 2019
Substrate comprising an embedded inductor and a thin film magnetic core
QUALCOMM INC6 citations73
US10069474B2Sep 4, 2018
Encapsulation of acoustic resonator devices
QUALCOMM INC4 citations73
US9966426B2May 8, 2018
Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications
QUALCOMM INC4 citations73
US9959964B2May 1, 2018
Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications
QUALCOMM INC6 citations73
US9875848B2Jan 23, 2018
MIM capacitor and method of making the same
QUALCOMM INC4 citations73
US9768109B2Sep 19, 2017
Integrated circuits (ICS) on a glass substrate
QUALCOMM INC3 citations73
US9673275B2Jun 6, 2017
Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits
QUALCOMM INC6 citations73
US9906318B2Feb 27, 2018
Frequency multiplexer
QUALCOMM INC3 citations71
US10903240B2Jan 26, 2021
Integrated circuits (ICs) on a glass substrate
QUALCOMM INC0 citations62
US10607980B2Mar 31, 2020
Passive-on-glass (POG) device and method
QUALCOMM INC0 citations52
US10332911B2Jun 25, 2019
Integrated circuits (ICs) on a glass substrate
QUALCOMM INC0 citations52
US10187031B2Jan 22, 2019
Tunable matching network
QUALCOMM INC0 citations52
US10074625B2Sep 11, 2018
Wafer level package (WLP) ball support using cavity structure
QUALCOMM INC1 citations52
US9560745B2Jan 31, 2017
Devices and methods to reduce stress in an electronic device
QUALCOMM INC0 citations52
US9264013B2Feb 16, 2016
Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods
QUALCOMM INC1 citations52
US9922956B2Mar 20, 2018
Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration
QUALCOMM INC1 citations51
US9343403B2May 17, 2016
Stress mitigation structure for wafer warpage reduction
QUALCOMM INC0 citations42