Inventor

ZHAN ZI-XIAN

TW2 patents

Patents

2 patents

US11973052B2Apr 30, 2024

Stud bump for wirebonding high voltage isolation barrier connection

TEXAS INSTRUMENTS INC0 citations59

US11848297B2Dec 19, 2023

Semiconductor device packages with high angle wire bonding and non-gold bond wires

TEXAS INSTRUMENTS INC0 citations46