Inventor
BHATT ANILKUMAR CHINUPRASAD
US20 patents
Patents
20 patentsUS6178093B1Jan 23, 2001
Information handling system with circuit assembly having holes filled with filler material
IBM168 citations99
US5822856AOct 20, 1998
Manufacturing circuit board assemblies having filled vias
IBM223 citations99
US6386890B1May 14, 2002
Printed circuit board to module mounting and interconnecting structure and method
IBM129 citations98
US6268016B1Jul 31, 2001
Manufacturing computer systems with fine line circuitized substrates
IBM89 citations97
US6138350AOct 31, 2000
Process for manufacturing a circuit board with filled holes
IBM37 citations96
US6000129ADec 14, 1999
Process for manufacturing a circuit with filled holes
IBM43 citations96
US6127025AOct 3, 2000
Circuit board with wiring sealing filled holes
IBM23 citations92
US5981880ANov 9, 1999
Electronic device packages having glass free non conductive layers
IBM33 citations92
US6569604B1May 27, 2003
Blind via formation in a photoimageable dielectric material
IBM18 citations91
US5707893AJan 13, 1998
Method of making a circuitized substrate using two different metallization processes
IBM26 citations91
US5953594ASep 14, 1999
Method of making a circuitized substrate for chip carrier structure
IBM27 citations90
US6127097AOct 3, 2000
Photoresist develop and strip solvent compositions and method for their use
IBM27 citations89
US6114019ASep 5, 2000
Circuit board assemblies having filled vias free from bleed-out
IBM13 citations82
US6414509B1Jul 2, 2002
Method and apparatus for in-situ testing of integrated circuit chips
IBM18 citations79
US6436803B2Aug 20, 2002
Manufacturing computer systems with fine line circuitized substrates
IBM11 citations73
US5922517AJul 13, 1999
Method of preparing a substrate surface for conformal plating
IBM9 citations73
US6255208B1Jul 3, 2001
Selective wafer-level testing and burn-in
IBM10 citations72
US6225028B1May 1, 2001
Method of making an enhanced organic chip carrier package
IBM12 citations71
US6110650AAug 29, 2000
Method of making a circuitized substrate
IBM12 citations71
US5905018AMay 18, 1999
Method of preparing a substrate surface for conformal plating
IBM3 citations62