Inventor
LIN YUSHUN
TW7 patents
Patents
7 patentsUS10267988B2Apr 23, 2019
Photonic package and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD24 citations93
US10459159B2Oct 29, 2019
Photonic package and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US11150404B2Oct 19, 2021
Photonic package and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US11101260B2Aug 24, 2021
Method of forming a dummy die of an integrated circuit having an embedded annular structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US12294002B2May 6, 2025
Integrated circuit package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12015023B2Jun 18, 2024
Integrated circuit package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10872871B2Dec 22, 2020
Chip package structure with dummy bump and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51