Inventor
OBATA TSUBASA
JP13 patents
Patents
13 patentsUS9293372B2Mar 22, 2016
Wafer processing method
DISCO CORP7 citations81
US10049934B2Aug 14, 2018
Wafer processing method
DISCO CORP2 citations72
US10840140B2Nov 17, 2020
Backside wafer dividing method using water-soluble protective film
DISCO CORP2 citations70
US9536787B2Jan 3, 2017
Wafer processing method
DISCO CORP3 citations70
US10985065B2Apr 20, 2021
Method of dicing a wafer by pre-sawing and subsequent laser cutting
DISCO CORP0 citations51
US9455149B2Sep 27, 2016
Plate-like object processing method
DISCO CORP0 citations51
US12296407B2May 13, 2025
Laser processing apparatus
DISCO CORP0 citations49
US9716039B2Jul 25, 2017
Wafer processing method
DISCO CORP1 citations49
US9698301B2Jul 4, 2017
Wafer processing method
DISCO CORP0 citations41
US9953871B2Apr 24, 2018
Wafer processing method
DISCO CORP0 citations40
US10861712B2Dec 8, 2020
Workpiece processing method
DISCO CORP0 citations39
US9779993B2Oct 3, 2017
Wafer processing method including attaching a protective tape to a front side of a functional layer to prevent debris adhesion
DISCO CORP0 citations39
US10796926B2Oct 6, 2020
Method of manufacturing glass interposer
DISCO CORP0 citations38