Inventor
SPURLIN TIGHE A
US11 patents
⚠️ This page may combine multiple inventors who share the name “SPURLIN TIGHE A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
7 patentsUS9865501B2Jan 9, 2018
Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
LAM RES CORP6 citations71
US9472377B2Oct 18, 2016
Method and apparatus for characterizing metal oxide reduction
LAM RES CORP4 citations71
US11280022B2Mar 22, 2022
Removal of electroplating bath additives
LAM RES CORP0 citations62
US10711366B2Jul 14, 2020
Removal of electroplating bath additives
LAM RES CORP1 citations62
US11208732B2Dec 28, 2021
Monitoring surface oxide on seed layers during electroplating
LAM RES CORP0 citations58
US10443146B2Oct 15, 2019
Monitoring surface oxide on seed layers during electroplating
LAM RES CORP1 citations58
US12535454B2Jan 27, 2026
Leveling compound control
LAM RES CORP0 citations49
NOVELLUS SYSTEMS INC
4 patentsUS9385035B2Jul 5, 2016
Current ramping and current pulsing entry of substrates for electroplating
NOVELLUS SYSTEMS INC10 citations83
US9070750B2Jun 30, 2015
Methods for reducing metal oxide surfaces to modified metal surfaces using a gaseous reducing environment
NOVELLUS SYSTEMS INC7 citations76
US10745817B2Aug 18, 2020
Configuration and method of operation of an electrodeposition system for improved process stability and performance
NOVELLUS SYSTEMS INC0 citations51
US9816196B2Nov 14, 2017
Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
NOVELLUS SYSTEMS INC1 citations48