P

Inventor

BEYER CHRISTIAN

DE54 patents
⚠️ This page may combine multiple inventors who share the name “BEYER CHRISTIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILTECTRA GMBH

28 patents
US12151314B2Nov 26, 2024

Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack

SILTECTRA GMBH3 citations74
US11527441B2Dec 13, 2022

Method for producing a detachment area in a solid body

SILTECTRA GMBH3 citations73
US11014199B2May 25, 2021

Method of modifying a solid using laser light

SILTECTRA GMBH2 citations73
US11004723B2May 11, 2021

Wafer production method

SILTECTRA GMBH2 citations73
US10661392B2May 26, 2020

Splitting of a solid using conversion of material

SILTECTRA GMBH2 citations73
US10593590B2Mar 17, 2020

Combined wafer production method with laser treatment and temperature-induced stresses

SILTECTRA GMBH2 citations73
US10312135B2Jun 4, 2019

Combined wafer production method with laser treatment and temperature-induced stresses

SILTECTRA GMBH3 citations73
US11869810B2Jan 9, 2024

Method for reducing the thickness of solid-state layers provided with components

SILTECTRA GMBH2 citations72
US10994442B2May 4, 2021

Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam

SILTECTRA GMBH3 citations72
US10978311B2Apr 13, 2021

Method for thinning solid body layers provided with components

SILTECTRA GMBH5 citations72
USRE50809EMar 3, 2026

Method of modifying a solid using laser light

SILTECTRA GMBH0 citations62
US12159805B2Dec 3, 2024

Method for producing wafers with modification lines of defined orientation

SILTECTRA GMBH1 citations62
US11996331B2May 28, 2024

Method for separating a solid body

SILTECTRA GMBH0 citations62
US11833617B2Dec 5, 2023

Splitting of a solid using conversion of material

SILTECTRA GMBH0 citations62
US11699616B2Jul 11, 2023

Method for producing a layer of solid material

SILTECTRA GMBH0 citations62
US11407066B2Aug 9, 2022

Splitting of a solid using conversion of material

SILTECTRA GMBH1 citations62
US10930560B2Feb 23, 2021

Laser-based separation method

SILTECTRA GMBH0 citations62
US10280107B2May 7, 2019

Method for guiding a crack in the peripheral region of a donor substrate

SILTECTRA GMBH1 citations62
US12211702B2Jan 28, 2025

Solid body and multi-component arrangement

SILTECTRA GMBH0 citations61
US11787083B2Oct 17, 2023

Production facility for separating wafers from donor substrates

SILTECTRA GMBH0 citations61
US11309191B2Apr 19, 2022

Method for modifying substrates based on crystal lattice dislocation density

SILTECTRA GMBH1 citations61
US11059202B2Jul 13, 2021

Method and device for producing planar modifications in solid bodies

SILTECTRA GMBH0 citations61
US12097641B2Sep 24, 2024

Method for forming a crack in an edge region of a donor substrate

SILTECTRA GMBH0 citations60
US12030216B2Jul 9, 2024

Method for separating wafers from donor substrates

SILTECTRA GMBH0 citations59
US10229835B2Mar 12, 2019

Splitting method and use of a material in a splitting method

SILTECTRA GMBH0 citations52
US10676386B2Jun 9, 2020

Method for guiding a crack in the peripheral region of a donor substrate

SILTECTRA GMBH0 citations51
US10960574B2Mar 30, 2021

Combined wafer production method with a receiving layer having holes

SILTECTRA GMBH0 citations46
US10707068B2Jul 7, 2020

Combined wafer production method with a multi-component receiving layer

SILTECTRA GMBH0 citations46

LEYBOLD VAKUUM GMBH

11 patents

INFINEON TECHNOLOGIES AG

2 patents

OERLIKON LEYBOLD VACUUM GMBH

2 patents

APPLIED MATERIALS INC

1 patent

HENRY MARKUS

1 patent

JOINT SOLAR SILICON GMBH & CO

1 patent

NAT UNIV SINGAPORE

1 patent

CSEM CENTRE SUISSE DELECTRONIQUE ET DE MICROTECHNIQUE SA—RECHERCHE ET DEV

1 patent

WALTER GERHARD WILHELM

1 patent

CUTISS AG

1 patent

Showing the top 50 of 54 patents by PatentIndex Score.