Inventor

LIN PAUL T

44 patents

⚠️ This page may combine multiple inventors who share the name “LIN PAUL T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN PAUL T

MOTOROLA INC

Leaded semiconductor device having accessible power supply pad terminals

Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding

Thermally enhanced semiconductor device having exposed backside and method for making the same

Shielded liquid encapsulated semiconductor device and method for making the same

Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film

Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery

Stacking three dimensional leadless multi-chip module and method for making the same

Overmolded semiconductor device having solder ball and edge lead connective structure

Three-dimensional multi-chip pad array carrier

Method of transferring solder balls onto a semiconductor device

Semiconductor device having a pad array carrier package

Semiconductor device having dual electrical contact sites

Pad array carrier IC device using flexible tape

Surface mountable semiconductor device having self loaded solder joints

Semiconductor device having an insertable heat sink and method for mounting the same

Method for fabricating multiple electronic devices within a single carrier structure

Method of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereon

Plastic pad array electronic AC device

Thin, molded, surface mount electronic device

Packaged semiconductor device having a low cost ceramic PGA package

Process for making a hermetic low cost pin grid array package

Semiconductor packaging and method

Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film

Process of making an electronic device package with peripheral carrier structure of low-cost plastic

Method for making an aluminum clad leadframe and a semiconductor device employing the same

Method of removing contaminants

Method for fabricating semiconductor device including package

Multiple electronic devices within a single carrier structure

Electronic device package with peripheral carrier structure of low-cost plastic

Method of programming ROM by offset masking of selected gates

Semiconductor device employing an aluminum clad leadframe

Surface mountable integrated circuit packages having solder bearing leads

(unassigned)

Solder balls and columns with stratified underfills on substrate for flip chip joining

Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configuration

Face-to-face (FTF) stacked assembly of substrate-on-bare-chip (SOBC) modules

Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site to simplify assembling and testing process

Multiple chip module configuration to simplify testing process and reuse of known-good chip-size package (CSP)

Configuration for testing a substrate mounted with a most performance-demanding integrated circuit

LIN PAUL T

Repairable semiconductor multi-package module having individualized package bodies on a PC board substrate

Package with solder-filled via holes in molding layers

Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density

KULICKE & SOFFA IND INC

Screen print under-bump metalization (UBM) to produce low cost flip chip substrate

CAMBRIDGE MEMORIES

Multilayer ceramic multi-chip, dual in-line packaging assembly

KULICKE & SOFFA INVESTMENTS

Design of interconnection pads with separated probing and wire bonding regions