Inventor · disambiguated record
Naoko Sera
Also filed as: SERA NAOKO
3 granted patents·39 citations·filing 2005–2014
62Inventor score
Top patents by PatentIndex Score
3 records- 0191US7378745B2Package substrate for a semiconductor device having thermoplastic resin layers and conductive patternsNEC ELECTRONICS CORP·Filed 2005·Granted May 27, 2008·39 cites·21 claims
- 0251US9087709B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jul 21, 2015·0 cites·20 claims
- 0350US8922001B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 30, 2014·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →