Inventor

OGIHARA CHIHO

JP3 patents

⚠️ This page may combine multiple inventors who share the name “OGIHARA CHIHO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OGIHARA CHIHO

2 patents

US8519529B2Aug 27, 2013

Semiconductor package with lid bonded on wiring board and method of manufacturing the same

OGIHARA CHIHO4 citations52

US8309859B2Nov 13, 2012

Method of manufacturing a substrate, substrate, device provided with a substrate, and determining method

OGIHARA CHIHO0 citations31

NEC ELECTRONICS CORP

1 patent

US7378745B2May 27, 2008

Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns

NEC ELECTRONICS CORP39 citations89