Inventor · disambiguated record
Ravindra Tanikella
Also filed as: TANIKELLA RAVINDRA · TANIKELLA RAVINDRA V · TANIKELLA RAVINDRA VIJAY
13 granted patents·6 pending applications·50 citations·filing 2004–2024
89Inventor score
Top patents by PatentIndex Score
19 records- 0193US7534648B2Aligned nanotube bearing composite materialINTEL CORP·Filed 2006·Granted May 19, 2009·23 cites·10 claims
- 0282US10211143B2Semiconductor device having polyimide layerINTEL CORP·Filed 2016·Granted Feb 19, 2019·2 cites·4 claims
- 0373US8129823B2Materials, structures and methods for microelectronic packagingTANIKELLA RAVINDRA V·Filed 2007·Granted Mar 6, 2012·4 cites·14 claims
- 0473US7517788B2System, apparatus, and method for advanced solder bumpingINTEL CORP·Filed 2005·Granted Apr 14, 2009·5 cites·10 claims
- 0571US9484277B2Materials, structures and methods for microelectronic packagingINTEL CORP·Filed 2014·Granted Nov 1, 2016·1 cites·7 claims
- 0666US7335608B2Materials, structures and methods for microelectronic packagingINTEL CORP·Filed 2004·Granted Feb 26, 2008·8 cites·16 claims
- 0763US2025062207A1Methods and apparatus to reduce cracking in glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0862US9147603B2Polymer grafting for enhanced dielectric and interconnect material adhesionINTEL CORP·Filed 2014·Granted Sep 29, 2015·1 cites·20 claims
- 0955US8530890B2Aligned nanotube bearing composite materialRARAVIKAR NACHIKET·Filed 2012·Granted Sep 10, 2013·0 cites·4 claims
- 1055US7790598B2System, apparatus, and method for advanced solder bumpingINTEL CORP·Filed 2009·Granted Sep 7, 2010·0 cites·6 claims
- 1153US8796825B2Materials, structures and methods for microelectronic packagingTANIKELLA RAVINDRA V·Filed 2012·Granted Aug 5, 2014·0 cites·12 claims
- 1251US7816487B2Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling sameINTEL CORP·Filed 2004·Granted Oct 19, 2010·4 cites·6 claims
- 1350US2023087838A1Protective coating on an edge of a glass coreINTEL CORP·Filed 2021·Application pending·0 cites
- 1450US2023088392A1Thermally conductive sleeves around tgvs for improved heat dissipation in glass core substrates or glass interposersINTEL CORP·Filed 2021·Application pending·0 cites
- 1550US2023092740A1Moat protection to prevent crack propagation in glass core substrates or glass interposersINTEL CORP·Filed 2021·Application pending·0 cites
- 1649US8222750B2Aligned nanotube bearing composite materialRARAVIKAR NACHIKET·Filed 2009·Granted Jul 17, 2012·2 cites·9 claims
- 1746US2021391264A1Microelectronic structures including bridgesINTEL CORP·Filed 2020·Application pending·0 cites
- 1845US2007096083A1Substrate core polymer nanocomposite with nanoparticles and randomly oriented nanotubes and methodINTEL CORP·Filed 2005·Application pending·0 cites
- 1941US11291122B2Apparatus with a substrate provided with plasma treatmentINTEL CORP·Filed 2017·Granted Mar 29, 2022·0 cites·14 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →