Inventor

BYUN JUNG SOO

KR14 patents

⚠️ This page may combine multiple inventors who share the name “BYUN JUNG SOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

8 patents

US10665535B2May 26, 2020

Carrier substrate and method of manufacturing semiconductor package using the same

SAMSUNG ELECTRONICS CO LTD3 citations72

US10916495B2Feb 9, 2021

Fan-out semiconductor package

SAMSUNG ELECTRONICS CO LTD3 citations71

US10796997B2Oct 6, 2020

Semiconductor package

SAMSUNG ELECTRONICS CO LTD2 citations71

US11699643B2Jul 11, 2023

Fan-out semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations61

US10790224B2Sep 29, 2020

Carrier substrate and method of manufacturing semiconductor package using the same

SAMSUNG ELECTRONICS CO LTD1 citations61

LEE SANG CHUL

2 patents

US8339796B2Dec 25, 2012

Embedded printed circuit board and method of manufacturing the same

LEE SANG CHUL10 citations83

US8881382B2Nov 11, 2014

Embedded printed circuit board and method of manufacturing the same

LEE SANG CHUL3 citations62

HONG SUK CHANG

1 patent

US8942004B2Jan 27, 2015

Printed circuit board having electronic components embedded therein

HONG SUK CHANG13 citations76

SAMSUNG ELECTRO MECH

1 patent

US9392698B2Jul 12, 2016

Chip-embedded printed circuit board and semiconductor package using the PCB, and manufacturing method of the PCB

SAMSUNG ELECTRO MECH6 citations69

SHIN SUNG WOO

1 patent

US8645183B2Feb 4, 2014

System for assessing an environmental load of building during life cycle

SHIN SUNG WOO4 citations67

BYUN JUNG-SOO

1 patent

US8618421B2Dec 31, 2013

Electronics component embedded PCB

BYUN JUNG-SOO2 citations53