Inventor

LEE CHANG BO

KR4 patents

⚠️ This page may combine multiple inventors who share the name “LEE CHANG BO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

2 patents

US9040838B2May 26, 2015

Method for forming solder resist and substrate for package

SAMSUNG ELECTRO MECH6 citations69

US9235129B2Jan 12, 2016

Composition for photoresist development and method of developing photoresist using the same

SAMSUNG ELECTRO MECH0 citations46

SAMSUNG ELECTRONICS CO LTD

1 patent

US10559540B2Feb 11, 2020

Fan-out semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations50

LEE CHANG BO

1 patent

US9107329B2Aug 11, 2015

Method for manufacturing printed circuit board

LEE CHANG BO0 citations28