Inventor
SAKATA TOUICHI
JP6 patents
Patents
6 patentsUS7061081B2Jun 13, 2006
Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof
HITACHI CHEMICAL CO LTD24 citations92
US6372859B1Apr 16, 2002
Thermoresistance adhesive and semiconductor device using the same
HITACHI CHEMICAL CO LTD29 citations91
US4530975AJul 23, 1985
Polyamide-imide resin composition
HITACHI CHEMICAL CO LTD16 citations72
US4294952AOct 13, 1981
Polyamide-imide resin and its production
HITACHI CHEMICAL CO LTD16 citations72
US4791157ADec 13, 1988
Polyetheramide-imide polymer composition
HITACHI CHEMICAL CO LTD6 citations62
US7560307B2Jul 14, 2009
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same
HITACHI CHEMICAL CO LTD1 citations52