Inventor
WU FEI-JAIN
TW9 patents
⚠️ This page may combine multiple inventors who share the name “WU FEI-JAIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPBOND TECHNOLOGY CORP
4 patentsUS9177830B1Nov 3, 2015
Substrate with bump structure and manufacturing method thereof
CHIPBOND TECHNOLOGY CORP4 citations65
US11651974B2May 16, 2023
Semiconductor package and method of fabricating the same
CHIPBOND TECHNOLOGY CORP1 citations61
US9961759B2May 1, 2018
Flexible substrate
CHIPBOND TECHNOLOGY CORP0 citations50
US12588541B2Mar 24, 2026
Flip chip bonding method and chip used therein
CHIPBOND TECHNOLOGY CORP0 citations37
MICRO ROBOTICS SYSTEMS INC
3 patentsUS4935261AJun 19, 1990
Method for controlling accurate dispensing of adhesive droplets
MICRO ROBOTICS SYSTEMS INC63 citations92
US4813588AMar 21, 1989
Inspection and repair of tab lifted leads
MICRO ROBOTICS SYSTEMS INC21 citations79
US5042688AAug 27, 1991
Method for controlling accurate dispensing of adhesive droplets
MICRO ROBOTICS SYSTEMS INC19 citations78