Inventor
Saiyajitara Amornthep
TH12 patents
⚠️ This page may combine multiple inventors who share the name “Saiyajitara Amornthep”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP BV
10 patentsUS10340211B1Jul 2, 2019
Sensor module with blade insert
NXP BV5 citations70
US10790220B2Sep 29, 2020
Press-fit semiconductor device
NXP BV3 citations67
US10249556B1Apr 2, 2019
Lead frame with partially-etched connecting bar
NXP BV5 citations65
US11049817B2Jun 29, 2021
Semiconductor device with integral EMI shield
NXP BV0 citations58
US12125771B2Oct 22, 2024
Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof
NXP BV0 citations57
US11482478B2Oct 25, 2022
Shielded electronic package and method of fabrication
NXP BV0 citations57
US11637024B2Apr 25, 2023
Method for glob top encapsulation using molding tape with elevated sidewall
NXP BV0 citations55
US10847385B2Nov 24, 2020
Glob top encapsulation using molding tape
NXP BV1 citations55
US11114239B2Sep 7, 2021
Electronic device, device package, and method of fabrication
NXP BV0 citations47
US10763203B1Sep 1, 2020
Conductive trace design for smart card
NXP BV0 citations34