Inventor

CHIEH CHIEN-WEI

TW2 patents

Patents

2 patents

US7411306B2Aug 12, 2008

Packaging structure and method of an image sensor module

IND TECH RES INST17 citations90

US7572676B2Aug 11, 2009

Packaging structure and method of an image sensor module

IND TECH RES INST10 citations82