Inventor
JANG JUN HYEONG
KR5 patents
Patents
5 patentsUS11183462B2Nov 23, 2021
Substrate having electronic component embedded therein
SAMSUNG ELECTRO MECH2 citations69
US11076487B2Jul 27, 2021
Electronic component embedded substrate
SAMSUNG ELECTRO MECH1 citations58
US11528804B2Dec 13, 2022
Printed circuit board
SAMSUNG ELECTRO MECH0 citations56
US11640952B2May 2, 2023
Electronic component embedded substrate
SAMSUNG ELECTRO MECH0 citations48
US12389546B2Aug 12, 2025
Printed circuit board, electronic component-embedded substrate, and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations46