Inventor · disambiguated record
Shadi A. Dayeh
Also filed as: DAYEH SHADI · DAYEH SHADI A
9 granted patents·4 pending applications·16 citations·filing 2008–2024
81Inventor score
Top patents by PatentIndex Score
13 records- 0183US9024295B2Nanowire photodetector and image sensor with internal gainUNIV CALIFORNIA·Filed 2013·Granted May 5, 2015·3 cites·12 claims
- 0281US8440997B2Nanowire photodetector and image sensor with internal gainWANG DELI·Filed 2008·Granted May 14, 2013·6 cites·16 claims
- 0373US10856764B2Method for forming a multielectrode conformal penetrating arrayUNIV CALIFORNIA·Filed 2015·Granted Dec 8, 2020·3 cites·16 claims
- 0470US11363979B2Addressable vertical nanowire probe arrays and fabrication methodsUNIV CALIFORNIA·Filed 2017·Granted Jun 21, 2022·2 cites·20 claims
- 0567US11056517B2Monolithic thin film elements and performance electronics, solar powered systems and fabricationUNIV CALIFORNIA·Filed 2016·Granted Jul 6, 2021·2 cites·17 claims
- 0658US2025090073A1Flexible and scalable microelectrode probe deviceUNIV CALIFORNIA·Filed 2024·Application pending·0 cites
- 0749US12065745B2Porous platinum nanorod electrode array flexible sensor devices and fabricationUNIV CALIFORNIA·Filed 2019·Granted Aug 20, 2024·0 cites·8 claims
- 0847US12157666B2Sharp, vertically aligned nanowire electrode arrays, high-yield fabrication and intracellular recordingUNIV CALIFORNIA·Filed 2019·Granted Dec 3, 2024·0 cites·18 claims
- 0947US2025235141A1Microelectrode grid with flap for continuous intraoperative neuromonitoringUNIV CALIFORNIA·Filed 2023·Application pending·0 cites
- 1045US11233142B2Intrinsically tunable and ultra-linear multi-fin MIS-HEMT devicesUNIV CALIFORNIA·Filed 2018·Granted Jan 25, 2022·0 cites·13 claims
- 1145US2023271320A1Tactile sensor array on flexible substrate with piezoelectric tft tactile sensorUNIV CALIFORNIA·Filed 2021·Application pending·0 cites
- 1242US2024226565A9Multi-hundred or thousand channel electrode electrophysiological array and fabrication methodUNIV CALIFORNIA·Filed 2022·Application pending·0 cites
- 1339US10679964B2Solid-state wafer bonding of functional materials on substrates and self-aligned contactsUNIV CALIFORNIA·Filed 2015·Granted Jun 9, 2020·0 cites·26 claims
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