P

Inventor

DEHAVEN PATRICK W

US21 patents
⚠️ This page may combine multiple inventors who share the name “DEHAVEN PATRICK W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

18 patents
US6123825ASep 26, 2000

Electromigration-resistant copper microstructure and process of making

IBM85 citations96
US7105360B2Sep 12, 2006

Low temperature melt-processing of organic-inorganic hybrid

IBM15 citations92
US6572982B1Jun 3, 2003

Electromigration-resistant copper microstructure

IBM15 citations92
US5943601AAug 24, 1999

Process for fabricating a metallization structure

IBM27 citations92
US5171642ADec 15, 1992

Multilayered intermetallic connection for semiconductor devices

IBM33 citations92
US6126761AOct 3, 2000

Process of controlling grain growth in metal films

IBM29 citations89
US7407875B2Aug 5, 2008

Low resistance contact structure and fabrication thereof

IBM16 citations84
US9224675B1Dec 29, 2015

Automatic capacitance tuning for robust middle of the line contact and silicide applications

IBM18 citations83
US6916729B2Jul 12, 2005

Salicide formation method

IBM16 citations83
US7951708B2May 31, 2011

Copper interconnect structure with amorphous tantalum iridium diffusion barrier

IBM5 citations63
US6509265B1Jan 21, 2003

Process for manufacturing a contact barrier

IBM4 citations62
US6909772B2Jun 21, 2005

Method and apparatus for thin film thickness mapping

IBM3 citations61
US6638374B2Oct 28, 2003

Device produced by a process of controlling grain growth in metal films

IBM2 citations61
US6361627B1Mar 26, 2002

Process of controlling grain growth in metal films

IBM2 citations61
US7456045B2Nov 25, 2008

Low temperature melt-processing of organic-inorganic hybrid

IBM0 citations52
US7291516B2Nov 6, 2007

Low temperature melt-processing of organic-inorganic hybrid

IBM0 citations52
US6180521B1Jan 30, 2001

Process for manufacturing a contact barrier

IBM0 citations51
US7223691B2May 29, 2007

Method of forming low resistance and reliable via in inter-level dielectric interconnect

IBM0 citations48

DEHAVEN PATRICK W

2 patents

HYPERNEX INC

1 patent