Inventor · disambiguated record
Hironobu Kawasato
Also filed as: KAWASATO HIRONOBU
6 granted patents·3 pending applications·18 citations·filing 1993–2007
77Inventor score
Top patents by PatentIndex Score
9 records- 0166US8026036B2Photosensitive resin composition and circuit substrate employing the sameNIPPON STEEL CHEMICAL CO·Filed 2006·Granted Sep 27, 2011·1 cites·10 claims
- 0250US6770421B2Photo- or heat-curable resin composition and multilayer printed wiring boardNIPPON STEEL CHEMICAL CO·Filed 2001·Granted Aug 3, 2004·4 cites·5 claims
- 0348US2006115671A1Copper-clad laminateNIPPON STEEL CHEMICAL CO·Filed 2005·Application pending·0 cites
- 0447US6444403B1Resin laminated wiring sheet, wiring structure using the same, and production method thereofNEC CORP·Filed 2000·Granted Sep 3, 2002·2 cites·3 claims
- 0545US6780549B2Photo-or heat-curable resin composition and multilayer printed wiring boardNIPPON STEEL CHEMICAL CO·Filed 2001·Granted Aug 24, 2004·2 cites·3 claims
- 0644US2008057299A1Laminate for wiring boardNIPPON STEEL CHEMICAL CO·Filed 2007·Application pending·0 cites
- 0741US6255444B1Aromatic ester (meth)acrylate dendrimers and curable resin compositionNIPPON STEEL CHEMICAL CO·Filed 1998·Granted Jul 3, 2001·8 cites·4 claims
- 0840US2007149758A1Aromatic polyamic acid and polyimideNIPPON STEEL CHEMICAL CO·Filed 2004·Application pending·0 cites
- 0926US5520809ASeparation membranesNIPPON STEEL CORP·Filed 1993·Granted May 28, 1996·1 cites·10 claims
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