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Inventor
KIM CHUL-SIK
KR
5 patents
⚠️ This page may combine multiple inventors who share the name “KIM CHUL-SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPPAC INC
3 patents
US7453156B2
Nov 18, 2008
Wire bond interconnection
CHIPPAC INC
11 citations
92
US7745322B2
Jun 29, 2010
Wire bond interconnection
CHIPPAC INC
4 citations
73
US7986047B2
Jul 26, 2011
Wire bond interconnection
CHIPPAC INC
2 citations
62
LEE HUN TEAK
1 patent
US9129826B2
Sep 8, 2015
Epoxy bump for overhang die
LEE HUN TEAK
6 citations
71
LEE HUN-TEAK
1 patent
US8129263B2
Mar 6, 2012
Wire bond interconnection and method of manufacture thereof
LEE HUN-TEAK
3 citations
61