Inventor · disambiguated record
Li-Jen Lin
Also filed as: LIN LI-JEN
4 granted patents·1 pending application·45 citations·filing 2008–2014
76Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0180US9711438B2Semiconductor device and method of forming a dual UBM structure for lead free bump connectionsSTATS CHIPPAC LTD·Filed 2014·Granted Jul 18, 2017·5 cites·5 claims
- 0278USD602815SElectric scooterKWANG YANG MOTOR CO·Filed 2009·Granted Oct 27, 2009·25 cites·1 claims
- 0376US8759209B2Semiconductor device and method of forming a dual UBM structure for lead free bump connectionsLIN LI-JEN·Filed 2011·Granted Jun 24, 2014·6 cites·30 claims
- 0452USD599710SMotorcycleKWANG YANG MOTOR CO·Filed 2008·Granted Sep 8, 2009·9 cites·1 claims
- 0539US2015048499A1Fine-pitch pillar bump layout structure on chipMACROTECH TECHNOLOGY INC·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →