Inventor

IM SU MI

KR5 patents

⚠️ This page may combine multiple inventors who share the name “IM SU MI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HONG YONG WOO

2 patents

US8211540B2Jul 3, 2012

Adhesive film composition, associated dicing die bonding film, die package, and associated methods

HONG YONG WOO6 citations64

US8394493B2Mar 12, 2013

Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same

HONG YONG WOO1 citations45

CHEIL IND INC

1 patent

US7863758B2Jan 4, 2011

Adhesive film composition, associated dicing die bonding film, and die package

CHEIL IND INC11 citations80

JEONG CHUL

1 patent

US8557896B2Oct 15, 2013

Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film

JEONG CHUL12 citations76

SAMSUNG SDI CO LTD

1 patent

US10793711B2Oct 6, 2020

Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same

SAMSUNG SDI CO LTD0 citations46