Inventor

ZHAN CHAU-JIE

TW6 patents

⚠️ This page may combine multiple inventors who share the name “ZHAN CHAU-JIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI TSUNG-FU

2 patents

US8130509B2Mar 6, 2012

Package carrier

TSAI TSUNG-FU11 citations82

US8575754B2Nov 5, 2013

Micro-bump structure

TSAI TSUNG-FU0 citations39

LIN YU-MIN

2 patents

US8415795B2Apr 9, 2013

Semiconductor device and assembling method thereof

LIN YU-MIN0 citations50

US9024441B2May 5, 2015

Bump structure and electronic packaging solder joint structure and fabricating method thereof

LIN YU-MIN0 citations39

IND TECH RES INST

1 patent

US9391049B2Jul 12, 2016

Molding package assembly and molding material

IND TECH RES INST8 citations82

CHANG TAO-CHIH

1 patent

US8598686B2Dec 3, 2013

Electronic device package structure with a hydrophilic protection layer and method for fabricating the same

CHANG TAO-CHIH0 citations46