Inventor
MAO I-HSIN
TW4 patents
Patents
4 patentsUS7642137B2Jan 5, 2010
Manufacturing method of chip package
CHIPMOS TECHNOLOGIES INC83 citations96
US7932531B2Apr 26, 2011
Chip package
CHIPMOS TECHNOLOGIES INC29 citations91
US8809088B2Aug 19, 2014
Structure of stacking chips and method for manufacturing the same
CHIPMOS TECHNOLOGIES INC2 citations61
US7446400B2Nov 4, 2008
Chip package structure and fabricating method thereof
CHIPMOS TECHNOLOGIES INC4 citations61